Comparison Between Numerical Study and Experimental Work on Heat Transfer from Heat Sink Under Transient Conditions
Author(s):
Ehsan F. Abbas*, Hussein H. Mohammed Ali, Nawzad J. Mahmood
Affiliation(s):
Department of Power Mechanics Techniques Engineering- Technical Engineering College (Kirkuk) Northern Technical University, Iraq.
Corresponding Author Email: [email protected]
This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Fins are widely used in most of the thermal equipment’s in the field of enhancing heat dissipation by extending a surface area. Micro-channel sink heat is an important part used in the cooling process in various devices, especially in electronic devices, to cool the processor part, power supply…etc. It’s available in a different shape and made of materials with high thermal conductivity, such as copper and aluminum. The present study examines the numerical solution to a small heat sink involving practical experiments at constant working conditions and air volumetric flow rates ranging from 20 to 100 cc/s in five increments of 20 cc/s at constant heat flux of 9000 W/m2. The COMSOL 5.2 software was used to simulate a heat sink model that uses solid-mode transient heat transfer. The process experiments were carried out under similar working conditions, which was to start recording the experimental data when the temperature of the heat sink base reached 40°C, and to continue for a period of 1200 seconds. Both the numerical simulation results and the practical work were compared and a good match was found between them. A higher error rate was obtained at a volumetric flow rate of 20 cc/s, which is not more than 1.2%.